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Showing results 1 to 7 of 7

1
Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer

Kim, Joungho; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Srikrishna Sitaraman; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01

2
Measurement-based Signal Quality Test of High-speed TSV Channel

Kim, Joungho; Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J; Jun So Pak, 2012 International Microelectronics and Packaging Society, IEEE, 2010-09-14

3
Noise Coupling Analysis between TSV and Active Circuit

Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

4
Noise coupling emulation between TSV and active circuit through metal oxide patch

Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28

5
Noise Coupling of Through-Via in Silicon and Glass Interposer

Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29

6
Noise Coupling of Through-Via in Silicon and Glass Interposer

Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19

7
Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC

Kim, Joungho; Insu Hwang; Youngwoo Kim; Jonghyun Cho; Venky Sundaram,; Rao Tummala, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28

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