Browse "EE-Conference Papers(학술회의논문)" by Author Jeong, Y.

Showing results 1 to 25 of 25

1
A 45 mW RTD/HBT mobile D-flip flop IC operating up to 32 Gb/s

Kim, T.; Jeong, Y.; Yang, Kyounghoon, 2006 International Conference on Indium Phosphide and Related Materials Conference Proceedings, pp.348 - 351, IEEE, 2006-05-07

2
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin

Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; et al, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27

3
A Ku-band InP-based RTD MMIC VCO with very low DC power consumption

Choi, S.; Jeong, Y.; Yang, Kyounghoon, 2005 International Conference on Indium Phosphide and Related Materials, pp.263 - 266, IEEE, 2005-05-08

4
A low DC-power multiplexer IC using an InP-based CML-mOBILE RTD/HBT technology

Choi, S.; Lee, J.; Jeong, Y.; Yang, Kyounghoon, 2008 International Conference on Indium Phosphide and Related Materials, IPRM 2008, 123, 2008-05-25

5
Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package

Jeong, Y.; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Kim, Joungho, 2004 Proceedings - 54th Electronic Components and Technology Conference, pp.575 - 580, IEEE, 2004-06-01

6
Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package

Jeong, Y.; Kim, Joungho; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Wong, C.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.215 - 220, IEEE, 2004-08-09

7
Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB

Kim, Joungho; Jeong, Y.; Kim, H.; Park, J.; Kim, J, 2003 Asia-Pacific Microwave Conference, 2003

8
Capturing village-level heritages with a hand-held camera-laser fusion sensor

Bok, Y.; Choi, D.; Jeong, Y.; Kweon, In-So, 2009 IEEE 12th International Conference on Computer Vision Workshops, ICCV Workshops 2009, pp.947 - 954, 2009-09-27

9
Fabrication of TiO 2 memristive arrays by Step and flash imprint lithography

Yun, D. K.; Kim, K. D.; Jeong, Y.; Choi, Sung-Yool; Jeong, J. H., NANO KOREA 2009, NANO KOREA 2009, 2009-08-27

10
Fmax enhancement in InP-based DHBTs using a new lateral reverse-etching technique

Jeong, Y.; Song, Y.; Choi, S.; Yoon, M.; Yang, Kyounghoon, 2003 International Conference Indium Phosphide and Related Materials, pp.22 - 25, IEEE, 2003-05-12

11
High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission

Kim, H.; Park, H.; Jeong, Y.; Kim, Joungho; Lee, Kyu S.; Hong, Kuk J.; Hong, Y., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.588 - 591, 2004-08-09

12
Implementation of a new functional digital IC for multiplexing operation based on RTDs

Choi, S.; Jeong, Y.; Lee, J.; Yang, Kyounghoon, 2008 8th IEEE Conference on Nanotechnology, IEEE-NANO, pp.681 - 683, 2008-08-18

13
Low DC-power Ku-band RTD VCO based on an InP monolithic RTD/HBT technology

Choi, S.; Jeong, Y.; Yang, Kyounghoon, 2005 IEEE MTT-S International Microwave Symposium, pp.1361 - 1364, IEEE, 2005-06-12

14
Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation

Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14

15
New RTD-based SET/RESET latch IC for high-speed MOBILE D-flip flops

Kim, T.; Jeong, Y.; Yang, Kyounghoon, 2005 International Conference on Indium Phosphide and Related Materials, pp.311 - 314, IEEE, 2005-05-08

16
Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module

Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09

17
Performance improvement of InP-based differential HBT VCO using the resonant tunneling diode

Jeong, Y.; Choi, S.; Yang, Kyounghoon, 2006 International Conference on Indium Phosphide and Related Materials, pp.42 - 45, IEEE, 2006-05-07

18
Personal information based IP autoconfiguration in tactical Mobile Ad-hoc Network

Jeong, Y.; Choi, H.; Ma, JoongSoo, Military Communications Conference 2006, MILCOM 2006, 2006-10-23

19
Power efficient relaying MAC protocol for rate adaptive wireless LANs

Na, J.; Jeong, Y.; Ma, JoongSoo, 3rd International Conference on Embedded Software and Systems, ICESS 2007, pp.664 - 675, 2007-05-14

20
Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Joungho; Park, H.H.; Kang, K.; et al, 2002 IEEE International Symposium on Electromagnetic Compatibility, pp.140 - 143, IEEE, 2002-08-19

21
Relative scale estimation between two camera motions

Jeong, Y.; Kweon, In-So, 2008 19th International Conference on Pattern Recognition, ICPR 2008, 2008-12-08

22
Robust visual lock-on and simultaneous localization for an unmanned aerial vehicle

Min, J.; Jeong, Y.; Kweon, In-So, 23rd IEEE/RSJ 2010 International Conference on Intelligent Robots and Systems, IROS 2010, pp.93 - 100, IEEE, 2010-10-18

23
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

24
Support aggregation via non-linear diffusion with disparity-dependent support-weights for stereo matching

Yoon, K.-J.; Jeong, Y.; Kweon, In-So, 9th Asian Conference on Computer Vision, ACCV 2009, pp.25 - 36, Asian Conference on Computer Vision, ACCV, 2009-09-23

25
Theoretical and experimental study of the InP/InGaAs PIN diode for millimeter-wave MMIC applications

Yang, J.G.; Choi, S.; Jeong, Y.; Yang, Kyounghoon, IPRM'07: IEEE 19th International Conference on Indium Phosphide and Related Materials, pp.133 - 136, 2007-05-14

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