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Showing results 1 to 14 of 14

1
3D Stackable Broadband Photoresponsive InGaAs Biristor Neuron for a Neuromorphic Visual System with Near 1 V Operation

Han, Joon-Kyu; Shim, Jaeho; Choi, Yang-Kyu; Geum, Dae-Myeong; Kim, Seongkwang; Yu, Ji-Man; Kim, Jongmin; et al, IEEE International Electron Devices Meeting, IEDM 2021, pp.1 - 4, 2021 IEEE International Electron Devices Meeting (IEDM), 2021-12-11

2
3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiplexer/Demultiplexer for Large-Scale Quantum Computing

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Lee, Jisung; Kim, Joon Pyo; Kim, Bong Ho; Suh, Yoon-Je; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.451 - 454, Institute of Electrical and Electronics Engineers Inc., 2022-12

3
3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Lee, Jisung; Park, Seung-Young; Kim, Sanghyeon, IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.328 - 329, Institute of Electrical and Electronics Engineers Inc., 2022-06

4
A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)

Geum, Dae-Myeong; Lim, Jinha; Jang, Junho; Ahn, Seungyeop; Kim, SeongKwang; Shim, Joonsup; Kim, Bong Ho; et al, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.413 - 414, Institute of Electrical and Electronics Engineers Inc., 2022-06

5
Biochemical spectroscopy based on germanium-on-insulator platform for mid-infrared optical sensor

Lim, Jinha; Shim, Joonsup; Kim, Inki; Kim, Seong Kwang; Lim, Hyeongrak; Ahn, Seung-Yeop; Park, Juhyuk; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.2411 - 2414, Institute of Electrical and Electronics Engineers Inc., 2022-12

6
Electrical characterization of wafer-bonded interfaces of p+InGaAs/n+InGaAs and p+GaAs/n+InGaAs

Geum, Dae-Myeong; Kim, Seongkwang; Lim, Hyeongrak; Park, Juhyuk; Jeong, Jaeyong; Han, JaeHoon; Choi, WonJun; et al, Global Photovoltaic Conference 2021, Korea Photovoltaic Society (KPVS), 2021-07-07

7
Free-carrier absorption-assisted photodetection using a waveguide-integrated bolometer with flat spectral response for integrated optical sensors

Shim, Joonsup; Lim, Jinha; Geum, Dae-Myeong; You, Jong-Bum; Yoon, Hyeonho; Kim, Joon Pyo; Baek, Woo Jin; et al, Infrared Sensors, Devices, and Applications XII 2022, SPIE, 2022-08-25

8
Grating - Resonance InGaAs Narrowband Photodetector for Multispectral Detection in NIR - SWIR Region

Jang, Junho; Shim, Joonsup; Lim, Jinha; Park, Gyeong Cheol; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2022 International Electron Devices Meeting, IEDM 2022, pp.1941 - 1944, Institute of Electrical and Electronics Engineers Inc., 2022-12

9
Grating - Resonance InGaAs Narrowband Photodetector for Multispectral Detection in NIR - SWIR Region

Jang, Junho; Shim, Joonsup; Lim, Jinha; Park, Gyeong Cheol; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2022 International Electron Devices Meeting, IEDM 2022, pp.1941 - 1944, Institute of Electrical and Electronics Engineers Inc., 2022-12-06

10
Heat management in monolithic 3D RF platform

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022, pp.79 - 81, Institute of Electrical and Electronics Engineers Inc., 2022-03

11
Low-loss Germanium-on-insulator passive waveguides for mid-infrared photonics platform

Lim, Jinha; Shim, Joonsup; Kim, Seong Kwang; Lim, Hyeongrak; Lee, Seung Woo; Geum, Dae-Myeong; Kim, Sanghyeon, OSA Optical Sensors and Sensing Congress 2022, Optical Society of America, 2022-07-11

12
Monolithic 3D Integrated InGaAs HEMTs on Si for Next-Generation Communication: Record fMAX and Relaxed Self-Heating of Top Devices by a Novel M3D Structure

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2021 IEEE International Electron Devices Meeting, IEDM 2021, pp.11.2.1 - 11.2.4, Institute of Electrical and Electronics Engineers Inc., 2021-12

13
Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC

Park, Juhyuk; Geum, Dae-Myeong; Baek, Woojin; Shieh, Johnson; Kim, Sanghyeon, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.383 - 384, Institute of Electrical and Electronics Engineers Inc., 2022-06

14
TiOx/Ti/TiOx Tri-layer Film-based Waveguide Bolometric Detector for On-Chip Si Photonic Sensors

SHIM, JOONSUP; Lim, Jinha; Geum, Dae-Myeong; You, Jong-Bum; Yoon, Hyeonho; Kim, Joon Pyo; Baek, Woo Jin; et al, IEEE International Electron Devices Meeting (IEDM), pp.9.1.1 - 9.1.4, IEEE, 2021-12-11

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