Heat management in monolithic 3D RF platform

Abstract

In this paper, we have investigated the thermal dissipation in the M3D RF platform and presented an M3D structure that can relax the self-heating and thermal coupling between top and bottom devices. At the same time, we have examined the effect of these structures on the RF performance of top devices and discussed how heat can be managed without affecting RF performance. This work offers insight into the thermal effects in the M3D RF platform and helps optimization of the M3D structure in terms of heat management. © 2022 IEEE.