Browse "EE-Conference Papers(학술회의논문)" by Author Choi, Kwangseong
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| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity Kim, Joungho; Kim, Lee-Sup; Cho, Jonghyun; Kim, Joohee; Bae, Hyuncheol; Choi, Kwangseong; Paek, Seungwook, 2013 Design Con, 2013 Design Con, 2013-01-31 |
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- 107 Article
- 8 Book
- 22,776 Conference
Date issued
- 2,090 2020 - 2024
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- 7,999 2000 - 2009
- 3,741 1990 - 1999
- 870 1980 - 1989