Browse "EE-Conference Papers(학술회의논문)" by Author Cho, Jong-Hyun
Showing results 1 to 3 of 3
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Power distribution network design and optimization based on frequency dependent target impedance Kim, Youngwoo; Kim, Kiyeong; Cho, Jong-Hyun; Kim, Joungho; Kang, Kibum; Yang, Taisik; Ra, Yun; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.89 - 92, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
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