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Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias Pak, J.S.; Ryu, C.; Kim, J.; Shim, Y.; Kim, G.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354, IEEE, 2008-05-19 |
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