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Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge pFETs on Si nFETs

Kim, Seongkwang; Lim, Hyeong-Rak; SHIM, JOONSUP; Baek, Woo Jin; Kim, Seongho; Park, YoungKeun; Jeong, Jaejoong; et al, 2023 International Electron Devices Meeting (IEDM), Institute of Electrical and Electronics Engineers Inc., 2023-12-11

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