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MEMS packaging method without any heating or external force using adhesive bonding assisted by capillary force Han, Chang-Hoon; Kim, Chang-Keun; Yoon, Yong Hoon; Seo, Min-Ho; Ko, Seung-Deok; Yoon, Jun-Bo, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, pp.1221 - 1224, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
THREE-DIMENSIONAL (3-D) RESHAPING TECHNIQUE IN MEMS DEVICES BY SOLELY ELECTRICAL CONTROL WITH ULTRAFINE TUNING RESOLUTION Yoon, Yong-Hoon; Han, Chang-Hoon; Yoon, Jun-Bo, The 27th IEEE International Conference on Micro electro Mechanical System, MEMS 2014, pp.660 - 663, IEEE, 2014-01-30 |
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