MEMS packaging method without any heating or external force using adhesive bonding assisted by capillary force

Abstract

This paper reports a simple microelectromechanical systems (MEMS) packaging method as one way of adhesive bonding at room temperature and atmospheric pressure. The adhesive material spreads into the patterned bonding interface perfectly only by capillary force and cured by ultraviolet (UV) exposure only. As a result of the moisture permeation test in the accelerated condition (85 °C / 85 % relative humidity(RH)), the proposed packaging method is expected to prevent moisture permeating over 14.4 years in the normal condition (25 °C / 50 % RH). Also, a fabricated MEMS LC-resonator showed only about 5 % difference of the resonant frequency after packaging, which demonstrates the packaging process does not degrade the MEMS device. Thus, the proposed packaging method can be easily used especially in the case of temperature sensitive device packaging.