Browse "EE-Conference Papers(학술회의논문)" by Author Han, Chang-Hoon
Showing results 3 to 4 of 4
| MEMS packaging method without any heating or external force using adhesive bonding assisted by capillary force Han, Chang-Hoon; Kim, Chang-Keun; Yoon, Yong Hoon; Seo, Min-Ho; Ko, Seung-Deok; Yoon, Jun-Bo, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, pp.1221 - 1224, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
| THREE-DIMENSIONAL (3-D) RESHAPING TECHNIQUE IN MEMS DEVICES BY SOLELY ELECTRICAL CONTROL WITH ULTRAFINE TUNING RESOLUTION Yoon, Yong-Hoon; Han, Chang-Hoon; Yoon, Jun-Bo, The 27th IEEE International Conference on Micro electro Mechanical System, MEMS 2014, pp.660 - 663, IEEE, 2014-01-30 |
Discover
Type
- 107 Article
- 8 Book
- 22,800 Conference
Date issued
- 2,114 2020 - 2024
- 8,145 2010 - 2019
- 7,999 2000 - 2009
- 3,741 1990 - 1999
- 870 1980 - 1989