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Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity Kim, Joungho; Kim, Lee-Sup; Cho, Jonghyun; Kim, Joohee; Bae, Hyuncheol; Choi, Kwangseong; Paek, Seungwook, 2013 Design Con, 2013 Design Con, 2013-01-31 |
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