EE-Conference Papers(학술회의논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 601 to 620 of 22932

601
Biochemical spectroscopy based on germanium-on-insulator platform for mid-infrared optical sensor

Lim, Jinha; Shim, Joonsup; Kim, Inki; Kim, Seong Kwang; Lim, Hyeongrak; Ahn, Seung-Yeop; Park, Juhyuk; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.2411 - 2414, Institute of Electrical and Electronics Engineers Inc., 2022-12

602
DRL-ISP: Multi-Objective Camera ISP with Deep Reinforcement Learning

Shin, UkCheol; Lee, Kyung Hyun; Kweon, In-So, 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2022, pp.7044 - 7051, Institute of Electrical and Electronics Engineers Inc., 2022-10

603
A 20-MHz 2.3-mW Receiver and a 25-V Transmitter for Ultrasound Capsule Endoscopy

Jeong, Kyeongwon; Choi, Jaesuk; Yun, Gichan; Choi, Injun; Son, Jeehoon; Hwang, Jae Youn; Ha, Sohmyung; et al, 2022 IEEE Asian Solid-State Circuits Conference, A-SSCC 2022, Institute of Electrical and Electronics Engineers Inc., 2022-11

604
Population Midpoint-Based Differential Evolution for Localization in Wireless Sensor Networks

Najarro, Lismer Andres Caceres; Song, Iickho; Dadlani, Aresh; Kim, Kiseon, 2022 IEEE GLOBECOM Workshops, GC Wkshps 2022, pp.335 - 340, Institute of Electrical and Electronics Engineers Inc., 2022-12

605
Power-Efficient Formation of UAV Swarm: Just like Flying Birds?

Kang, Honggu; Joung, Jingon; Kang, Joonhyuk, IEEE Global Communications Conference, GLOBECOM 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

606
Cochlear implant wireless power transfer system design for high efficiency and link gain stability using a proposed stagger tuning method

Hong, Seokwoo; Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Kim, Hongseok; Lee, Hoseung; Ahn, Woojin; et al, IEEE Wireless Power Transfer Conference, WPTC 2020, pp.26 - 29, Institute of Electrical and Electronics Engineers Inc., 2020-11

607
Image captioning with very scarce supervised data: Adversarial semi-supervised learning approach

Kim, Dong-Jin; Choi, Jinsoo; Oh, Tae-Hyun; Kweon, In-So, Conference on Empirical Methods in Natural Language Processing and 9th International Joint Conference on Natural Language Processing, EMNLP-IJCNLP 2019, pp.2012 - 2023, Association for Computational Linguistics, 2019-11

608
Electrical performance comparison between coaxial and non-coaxial silicone rubber socket

Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06

609
Detection of open and short faults in 3D-ICs based on through silicon via (TSV)

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Joungho; Fan, Jun, IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.405 - 410, Institute of Electrical and Electronics Engineers Inc., 2017-08

610
An OpenCL-based SIFT Accelerator for Image Features Extraction on FPGA in Mobile Edge Computing Environment

Le, Duc Canh; Oh, Eun Young; Jeong, Jae Ho; Kim, Sung Hyun; Jeon, Minsu; Jang, Jonghyun; Youn, Chan-Hyun, 9th International Conference on Information and Communication Technology Convergence, ICTC 2018, pp.1406 - 1410, Institute of Electrical and Electronics Engineers Inc., 2018-10

611
Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs

Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06

612
Cooperative UAV Jammer for Enhancing Physical Layer Security: Robust Design for Jamming Power and Trajectory

Roh, Yujung; Jung, Seungjae; Kang, Joonhyuk, IEEE Military Communications Conference, MILCOM 2019, Institute of Electrical and Electronics Engineers Inc., 2019-11

613
Radar Imaging Based on IEEE 802.11ad Waveform

Han, Geonho; Choi, Junil, IEEE Global Communications Conference, GLOBECOM 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

614
Audio frequency ground integrity modeling and measurement for a TDMA smartphone system

Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12

615
Coding across heterogeneous parallel erasure broadcast channels is useful

Kim, Sunghyun; Mohajer, Soheil; Suh, Changho, IEEE International Symposium on Information Theory, ISIT 2017, pp.1883 - 1887, Institute of Electrical and Electronics Engineers Inc., 2017-06

616
Iterative Normalized Matched Filtering for Detection of Chemical Agents in Hyperspectral Imaging

Yu, Hyeong-Geun; Lee, Jay-Hoon; Park, Dong-Jo; Nam, Hyun-Woo; Park, Byeong-Hwang, IEEE International Conference on Consumer Electronics - Asia, ICCE-Asia 2018, Institute of Electrical and Electronics Engineers Inc., 2018-06

617
On Full-Duplex Communication in Cooperative Cognitive Radio Networks

Lee, Seungwon; Park, Sangwoo; Song, Iickho; Zhang, Yalei; Nguyen, Mai TP, International Conference on Computational Science and Computational Intelligence, CSCI 2016, pp.1414 - 1415, Institute of Electrical and Electronics Engineers Inc., 2016-12

618
Receding horizon–based RRT* algorithm for a UAV real-time path planner

Lee, Hanseob; Lee, Dasol; Shim, David Hyunchul, AIAA Information Systems-Infotech At Aerospace Conference, 2017, American Institute of Aeronautics and Astronautics Inc, AIAA, 2017-01

619
Behavior Selection of Social Robots Using Developmental Episodic Memory-Based Mechanism of Thought

Ko, Woo-Ri; Kim, Jong-Hwan, IEEE International Conference on Consumer Electronics - Asia, ICCE-Asia 2018, Institute of Electrical and Electronics Engineers Inc., 2018-06

620
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

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