(A) lot-to-order assignment problem for multi-chip package assembly

Abstract

We examine a lot-to-order assignment problem for multi-chip semiconductor packaging. Several different chips are assembled into a product. An order can be filled with multiple products that are physically identical but use different chips. We wish to find a method of assigning the chips in the stock to the orders for each day so that the required orders are fulfilled as much as possible and the number of residual chips is minimized. While the problem can be modeled as an integer programming model, due to the complexity, we propose four efficient heuristic procedures. Each procedure consists of three stages, selecting an order with some priority, selecting the product mix for the order, and assigning chips to each product. We present computational performance of the proposed heuristic procedures as compared with the existing heuristic rule.