DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Lee, Tae-Eog | - |
dc.contributor.advisor | 이태억 | - |
dc.contributor.author | Lee, Myung-In | - |
dc.contributor.author | 이명인 | - |
dc.date.accessioned | 2011-12-14T04:07:33Z | - |
dc.date.available | 2011-12-14T04:07:33Z | - |
dc.date.issued | 2005 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=243620&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/40709 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 산업공학과, 2005.2, [ iv, 54 p. ] | - |
dc.description.abstract | We examine a lot-to-order assignment problem for multi-chip semiconductor packaging. Several different chips are assembled into a product. An order can be filled with multiple products that are physically identical but use different chips. We wish to find a method of assigning the chips in the stock to the orders for each day so that the required orders are fulfilled as much as possible and the number of residual chips is minimized. While the problem can be modeled as an integer programming model, due to the complexity, we propose four efficient heuristic procedures. Each procedure consists of three stages, selecting an order with some priority, selecting the product mix for the order, and assigning chips to each product. We present computational performance of the proposed heuristic procedures as compared with the existing heuristic rule. | eng |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | assignment space effectotide | - |
dc.subject | order | - |
dc.subject | lot | - |
dc.subject | bin covering | - |
dc.subject | Multi-chip | - |
dc.subject | Au nanoparticles | - |
dc.subject | 할당 재고효과 탄소나노튜브 구조 ?입체선택적인 요오드고리화 반응에 관한 연구?발광 물질 | - |
dc.subject | 주문 | - |
dc.subject | 로트 | - |
dc.subject | 빈 커버링 | - |
dc.subject | 멀티칩 | - |
dc.subject | the flow analysis of 100W-stack | - |
dc.subject | Carbon nanotubeis-Alkenesumina on | - |
dc.title | (A) lot-to-order assignment problem for multi-chip package assembly | - |
dc.title.alternative | 멀티 칩 패키지 조립을 위한 주문 별 로트 할당 문제 | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 243620/325007 | - |
dc.description.department | 한국과학기술원 : 산업공학과, | - |
dc.identifier.uid | 020033436 | - |
dc.contributor.localauthor | Lee, Tae-Eog | - |
dc.contributor.localauthor | 이태억 | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.