An image sensor module is provided to minimize the thickness of an image sensor module by using glass coated with an IR filter as a substrate such that the glass has the same size as an image sensor chip. A non-solder bump is formed at each input/output terminal. A partition wall of a lattice structure is formed on an image sensing surface of an image sensor chip except an image sensing region is electrically connected to a glass substrate having an IR (infrared ray) coating layer and a metal electrode by a flip chip bonding process while a chip sealing process is performed. After a metal interconnection is redistributed to the lower surface of the glass substrate, a solder and a non-solder bump are formed.