Method for producing field effect transistor and transistor structure made thereof전계 효과 트랜지스터 제조 방법 및 이로부터 제조된 트랜지스터 구조

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This invention discloses a method for manufacturing field effect transistors with channels composed of silicon fins and silicon main bodies and the transistors, in which, the orientation of the fin is defferent from the silicon main body. The method includes the following steps: a, forming a hard mask pattern on a base plate including a Si film, b, etching the Si film to a preset thickness anisotropically using said pattern as the mask so as to form not only Si fins going to form channels and Si pattern with source/drain region but also form a Si main body connecting the fins to form channels, c, using the active mask to etch the Si film partly to isolate the source/drain region and the device and d, growing grid dielectric film on the Si channels and depositing grid material and grid mask on the structure to form a grid region.
Assignee
KAIST
Country
CC (Cocos (Keeling) Islands)
Application Date
2005-12-20
Application Number
200510132690.7
Registration Date
2011-12-14
Registration Number
001988116
URI
http://hdl.handle.net/10203/303564
Appears in Collection
EE-Patent(특허)
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