(A) study on the magnetically dispersed four-layer anchoring polymer layer (APL) structure for fine-pitch test socket interposers

Abstract

The test socket interposer is an essential component to connect the test body and the test board during semiconductor package inspection. However, the existing interposer used in the industry is difficult to be applied to the fine pitch inspection socket due to structural limitations. Therefore, a double layer structure of a self-dispersed anchoring polymer layer was proposed.

In this study, a multi-layered structure was introduced to improve the weaknesses of these alternative structures.

In Chapter 2, it was confirmed that the self-dispersing uniformity of the polyvinyl fluoride anchoring polymer layer was improved under the optimized conductive particle content of the fixing polymer layer solution and low atmospheric humidity conditions by using the nickel patterned glass substrate.

In Chapter 3, the dispersion behavior of conductive particles of the anchoring polymer layer due to stacked and the effect on vertical alignment were analyzed. If the surface was flattened, when the anchoring polymer layer was coated with an appropriate thickness, there was no problem in the dispersion behavior, and it was confirmed that the vertical alignment property was affected according to the diameter deviation of the conductive particles.

The completed four-layer structure fixing polymer layer succeeded in measuring the daisy chain resistance through a test substrate of 140 microns. However, there were also specimens whose resistance was not measured due to the decrease in the density of the effective conductive lines that survived according to the lamination. Finally, it showed stable resistance in 1000 repeatability tests.