OPTICAL DEVICE AND METHOD OF FABRICATING THE SAME광소자 및 그의 제조방법

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The present invention relates to an optical device comprising a first sub-chip and a second sub-chip flipped over on the first sub-chip. The first sub-chip includes a first substrate, a first lower cladding pattern on a first surface of the first substrate, and a first core layer on the first lower cladding pattern. The second sub-chip includes a second substrate, a second lower cladding pattern on a second surface of the second substrate, and a second core layer on the second lower cladding pattern. The first surface of the first substrate faces the second surface of the second substrate. The first lower cladding pattern has a first top surface parallel to the first surface and a first sidewall inclined to the first surface. The first core layer includes a first core part on the first top surface and a first side part on the first sidewall.
Assignee
KAIST
Country
US (United States)
Application Date
2020-04-03
Application Number
16839560
Registration Date
2022-04-05
Registration Number
11294121
URI
http://hdl.handle.net/10203/292669
Appears in Collection
PH-Patent(특허)
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