OPTICAL DEVICE AND METHOD OF FABRICATING THE SAME광소자 및 그의 제조방법

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dc.contributor.authorLee, Hansuekko
dc.contributor.authorKim, Daegonko
dc.contributor.authorHan, Sangyoonko
dc.contributor.authorHwang, Joonhyukko
dc.date.accessioned2022-04-13T07:16:37Z-
dc.date.available2022-04-13T07:16:37Z-
dc.identifier.urihttp://hdl.handle.net/10203/292669-
dc.description.abstractThe present invention relates to an optical device comprising a first sub-chip and a second sub-chip flipped over on the first sub-chip. The first sub-chip includes a first substrate, a first lower cladding pattern on a first surface of the first substrate, and a first core layer on the first lower cladding pattern. The second sub-chip includes a second substrate, a second lower cladding pattern on a second surface of the second substrate, and a second core layer on the second lower cladding pattern. The first surface of the first substrate faces the second surface of the second substrate. The first lower cladding pattern has a first top surface parallel to the first surface and a first sidewall inclined to the first surface. The first core layer includes a first core part on the first top surface and a first side part on the first sidewall.-
dc.titleOPTICAL DEVICE AND METHOD OF FABRICATING THE SAME-
dc.title.alternative광소자 및 그의 제조방법-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthorLee, Hansuek-
dc.contributor.nonIdAuthorKim, Daegon-
dc.contributor.nonIdAuthorHwang, Joonhyuk-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber16839560-
dc.identifier.patentRegistrationNumber11294121-
dc.date.application2020-04-03-
dc.date.registration2022-04-05-
dc.publisher.countryUS-
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PH-Patent(특허)
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