DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Min Seong | ko |
dc.contributor.author | Kim, Seunghwan | ko |
dc.contributor.author | Choi, Jungrak | ko |
dc.contributor.author | Kim, Seonggi | ko |
dc.contributor.author | Han, Chankyu | ko |
dc.contributor.author | Lee, Yung | ko |
dc.contributor.author | Jung, Youngdo | ko |
dc.contributor.author | Park, Jaeho | ko |
dc.contributor.author | Oh, Sunjong | ko |
dc.contributor.author | Bae, Byeong-Soo | ko |
dc.contributor.author | Lim, Hyuneui | ko |
dc.contributor.author | Park, Inkyu | ko |
dc.date.accessioned | 2022-02-17T06:43:38Z | - |
dc.date.available | 2022-02-17T06:43:38Z | - |
dc.date.created | 2022-01-10 | - |
dc.date.created | 2022-01-10 | - |
dc.date.created | 2022-01-10 | - |
dc.date.issued | 2022-01 | - |
dc.identifier.citation | ACS APPLIED MATERIALS & INTERFACES, v.14, no.1, pp.1826 - 1837 | - |
dc.identifier.issn | 1944-8244 | - |
dc.identifier.uri | http://hdl.handle.net/10203/292264 | - |
dc.description.abstract | In order to realize a transition from conventional to stretchable electronics, it is necessary to make a universal stretchable circuit board in which passive/active components can be robustly integrated. We developed a stretchable printed circuit board (s-PCB) platform that enables easy and reliable integration of various electronic components by utilizing a modulus-gradient polymeric substrate, liquid metal amalgam (LMA) circuit traces, and Ag nanowire (AgNW) contact pads. Due to the LMA-AgNW biphasic structure of interconnection, the LMA is hermetically sealed by a homogeneous interface, realizing complete leak-free characteristics. Furthermore, integration reliability is successfully achieved by local strain control of the stretchable substrate with a selective glass fiber reinforcement (GFR). A strain localization derived by GFR makes almost 50,000% of strain difference within the board, and the amount of deformation applied to the constituent elements can be engineered. We finally demonstrated that the proposed integrated platform can be utilized as a universal s-PCB capable of integrating rigid/conventional electronic components and soft material-based functional elements with negligible signal distortion under various mechanical deformations. | - |
dc.language | English | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.title | Stretchable Printed Circuit Board Based on Leak-Free Liquid Metal Interconnection and Local Strain Control | - |
dc.type | Article | - |
dc.identifier.wosid | 000736103900001 | - |
dc.identifier.scopusid | 2-s2.0-85121929654 | - |
dc.type.rims | ART | - |
dc.citation.volume | 14 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 1826 | - |
dc.citation.endingpage | 1837 | - |
dc.citation.publicationname | ACS APPLIED MATERIALS & INTERFACES | - |
dc.identifier.doi | 10.1021/acsami.1c16177 | - |
dc.contributor.localauthor | Bae, Byeong-Soo | - |
dc.contributor.localauthor | Park, Inkyu | - |
dc.contributor.nonIdAuthor | Kim, Seunghwan | - |
dc.contributor.nonIdAuthor | Kim, Seonggi | - |
dc.contributor.nonIdAuthor | Han, Chankyu | - |
dc.contributor.nonIdAuthor | Jung, Youngdo | - |
dc.contributor.nonIdAuthor | Oh, Sunjong | - |
dc.contributor.nonIdAuthor | Lim, Hyuneui | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | stretchable electronics | - |
dc.subject.keywordAuthor | printed circuit board | - |
dc.subject.keywordAuthor | liquid metal | - |
dc.subject.keywordAuthor | silver nanowire | - |
dc.subject.keywordAuthor | modulus gradient | - |
dc.subject.keywordPlus | ELECTRONICS | - |
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