Semiconductor package and semiconductor apparatus반도체 패키지 및 반도체 장치
A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.
- Country
- US (United States)
- Application Date
- 2020-01-20
- Application Number
- 16747404
- Registration Date
- 2021-12-21
- Registration Number
- 11205601
- Appears in Collection
- ME-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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