Semiconductor package and semiconductor apparatus반도체 패키지 및 반도체 장치
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Bong Jae | ko |
| dc.contributor.author | Lee, Eung chang | ko |
| dc.contributor.author | Kang, Heeyoub | ko |
| dc.contributor.author | Yang, Haejung | ko |
| dc.contributor.author | Oh, Youngrok | ko |
| dc.contributor.author | Lee, Kitaek | ko |
| dc.date.accessioned | 2022-02-10T06:42:47Z | - |
| dc.date.available | 2022-02-10T06:42:47Z | - |
| dc.identifier.uri | http://hdl.handle.net/10203/292210 | - |
| dc.description.abstract | A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve. | - |
| dc.title | Semiconductor package and semiconductor apparatus | - |
| dc.title.alternative | 반도체 패키지 및 반도체 장치 | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | Lee, Bong Jae | - |
| dc.contributor.nonIdAuthor | Lee, Eung chang | - |
| dc.contributor.nonIdAuthor | Kang, Heeyoub | - |
| dc.contributor.nonIdAuthor | Yang, Haejung | - |
| dc.contributor.nonIdAuthor | Oh, Youngrok | - |
| dc.contributor.nonIdAuthor | Lee, Kitaek | - |
| dc.contributor.assignee | KAIST, SAMSUNG ELECTRONICS CO LTD | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 16747404 | - |
| dc.identifier.patentRegistrationNumber | 11205601 | - |
| dc.date.application | 2020-01-20 | - |
| dc.date.registration | 2021-12-21 | - |
| dc.publisher.country | US | - |
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