학위논문(박사) - 한국과학기술원 : 신소재공학과, 2018.8,[iv, 72 p. :]
Non-conductive film; double layer; micro-bump; solder joint morphology; Cu-pillar/SnAg bump; thermo-compression bonding; 비전도 접속 필름; 이중층; 마이크로 범프; 솔더 형상; 열압착본딩
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