학위논문(석사) - 한국과학기술원 : 신소재공학과, 2019.8,[v, 52 p. :]
Fan-Out Panel-Level Packages (FOPLPs)▼aEpoxy Molding Films (EMFs)▼aepoxy formulation▼awarpage; die shift; 팬 아웃 패널 레벨 패키지▼a에폭시 몰딩 필름▼a에폭시 포뮬레이션▼a워피지▼a다이 시프트
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