Molecularly engineered copolyimide film for capacitive humidity sensor

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We present a capacitive humidity sensor with molecularly engineered polyimide (PI) sensing layer. Molecularly engineered PIs were successfully prepared by synthesizing polyamic acids (PAAs) through blending of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) with 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6-FDA) as monomer, followed by thermal imidization, respectively. The molecularly engineered PIs exhibited high thermal stability as well as controllable water uptake properties. Capacitive performances of the humidity sensor with PIs were efficiently increased via simple molecular blending.
Publisher
ELSEVIER
Issue Date
2020-06
Language
English
Article Type
Article
Citation

MATERIALS LETTERS, v.268

ISSN
0167-577X
DOI
10.1016/j.matlet.2020.127565
URI
http://hdl.handle.net/10203/282034
Appears in Collection
RIMS Journal Papers
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