A 0.6pJ/b 3Gb/s/ch transceiver in 0.18 μm CMOS for 10mm on-chip interconnects

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This paper presents a high speed and low energy transceiver for 10 mm long minimum width on-chip global interconnects. To improve the link bandwidth, the transmitter employs a capacitive-resistive pre-emphasis technique and the receiver employs the AC-coupled resistive feedback inverter (RFI) de-emphasis technique. Exploiting two emphasis techniques, the proposed interconnect achieves 1.26 GHz bandwidth which is 20 times improved compared to conventional link. As a result, it achieves error-free 3 Gb/s data rate and consumes less than 0.6 pJ/b during transmission by using low-swing and pulse signaling. The test chip is designed using 1.8 V 0.18 mum 6 M CMOS technology.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Issue Date
2008-05-18
Language
English
Citation

2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008, pp.2861 - 2864

ISSN
0271-4302
DOI
10.1109/ISCAS.2008.4542054
URI
http://hdl.handle.net/10203/276993
Appears in Collection
EE-Conference Papers(학술회의논문)
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