A 0.6pJ/b 3Gb/s/ch transceiver in 0.18 μm CMOS for 10mm on-chip interconnects

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dc.contributor.authorBae, Joonsungko
dc.contributor.authorKim, Joo-Youngko
dc.contributor.authorYoo, Hoi-Junko
dc.date.accessioned2020-10-26T07:55:27Z-
dc.date.available2020-10-26T07:55:27Z-
dc.date.created2020-10-12-
dc.date.issued2008-05-18-
dc.identifier.citation2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008, pp.2861 - 2864-
dc.identifier.issn0271-4302-
dc.identifier.urihttp://hdl.handle.net/10203/276993-
dc.description.abstractThis paper presents a high speed and low energy transceiver for 10 mm long minimum width on-chip global interconnects. To improve the link bandwidth, the transmitter employs a capacitive-resistive pre-emphasis technique and the receiver employs the AC-coupled resistive feedback inverter (RFI) de-emphasis technique. Exploiting two emphasis techniques, the proposed interconnect achieves 1.26 GHz bandwidth which is 20 times improved compared to conventional link. As a result, it achieves error-free 3 Gb/s data rate and consumes less than 0.6 pJ/b during transmission by using low-swing and pulse signaling. The test chip is designed using 1.8 V 0.18 mum 6 M CMOS technology.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleA 0.6pJ/b 3Gb/s/ch transceiver in 0.18 μm CMOS for 10mm on-chip interconnects-
dc.typeConference-
dc.identifier.wosid000258532102176-
dc.identifier.scopusid2-s2.0-51749116188-
dc.type.rimsCONF-
dc.citation.beginningpage2861-
dc.citation.endingpage2864-
dc.citation.publicationname2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSeattle, WA-
dc.identifier.doi10.1109/ISCAS.2008.4542054-
dc.contributor.localauthorKim, Joo-Young-
dc.contributor.localauthorYoo, Hoi-Jun-
dc.contributor.nonIdAuthorBae, Joonsung-
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EE-Conference Papers(학술회의논문)
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