DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, Kwansoo | ko |
dc.contributor.author | Kang, Yi Young | ko |
dc.contributor.author | Ahn, Hyun Jeong | ko |
dc.contributor.author | Kim, Dong-Gyun | ko |
dc.contributor.author | Park, No Kyun | ko |
dc.contributor.author | Choi, Siyoung Q. | ko |
dc.contributor.author | Won, Jong Chan | ko |
dc.contributor.author | Kim, Yun Ho | ko |
dc.date.accessioned | 2020-03-19T01:26:03Z | - |
dc.date.available | 2020-03-19T01:26:03Z | - |
dc.date.created | 2020-02-26 | - |
dc.date.created | 2020-02-26 | - |
dc.date.created | 2020-02-26 | - |
dc.date.issued | 2020-02 | - |
dc.identifier.citation | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.82, pp.173 - 179 | - |
dc.identifier.issn | 1226-086X | - |
dc.identifier.uri | http://hdl.handle.net/10203/272392 | - |
dc.description.abstract | This work offers a simple fabrication of porous boron-nitride-(BN)/polyimide-(PI) composite films with high thermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification (HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed and three-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BN contents in the BN/PI composite foams were adjusted in the range of 20-80 wt%. The porosities of the composite films were controlled according to the hot-pressing conditions such as the temperature. The porous BN/PI composite films exhibited high thermal diffusivities of 0.059-1.033 mm(2)/s and low dielectric constants of 2.08-3.48 at 1 GHz for BN contents of 20-80 wt%. In particular, the BN/PI composite films had extremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN content and pressing conditions. (C) 2019 The Korean Society of Industrial and Engineering Chemistry. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE INC | - |
dc.title | Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method | - |
dc.type | Article | - |
dc.identifier.wosid | 000509616700020 | - |
dc.identifier.scopusid | 2-s2.0-85074396607 | - |
dc.type.rims | ART | - |
dc.citation.volume | 82 | - |
dc.citation.beginningpage | 173 | - |
dc.citation.endingpage | 179 | - |
dc.citation.publicationname | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY | - |
dc.identifier.doi | 10.1016/j.jiec.2019.10.010 | - |
dc.identifier.kciid | ART002558556 | - |
dc.contributor.localauthor | Choi, Siyoung Q. | - |
dc.contributor.nonIdAuthor | Yang, Kwansoo | - |
dc.contributor.nonIdAuthor | Kang, Yi Young | - |
dc.contributor.nonIdAuthor | Ahn, Hyun Jeong | - |
dc.contributor.nonIdAuthor | Kim, Dong-Gyun | - |
dc.contributor.nonIdAuthor | Park, No Kyun | - |
dc.contributor.nonIdAuthor | Won, Jong Chan | - |
dc.contributor.nonIdAuthor | Kim, Yun Ho | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | High-internal-phase Pickering emulsion | - |
dc.subject.keywordAuthor | Polymer composite | - |
dc.subject.keywordAuthor | High thermal diffusivity | - |
dc.subject.keywordAuthor | Low dielectric constant | - |
dc.subject.keywordPlus | POLYMER COMPOSITES | - |
dc.subject.keywordPlus | CONDUCTIVITY | - |
dc.subject.keywordPlus | NITRIDE | - |
dc.subject.keywordPlus | PRECURSOR | - |
dc.subject.keywordPlus | HYBRID | - |
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