Warpage prediction of chip package using simplified model of PCB substrate = PCB 기판의 단순화 모델을 통한 칩 패키지의 휨 예측

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Warpage of chip package causes poor product yield in the process of mass production of electronic products. However, the prediction of warpage is difficult due to the complex and diverse substrate structures and the long processes. In this study, thermo-mechanical properties of epoxy materials and electroplated copper were measured accurately, and simplified printed circuit board model was suggested that could respond to various printed circuit board structures to enhance the warpage predictability of chip packages. Especially, dielectric glass fiber reinforced polymers in printed circuit board (PCB) became thinner recently, which results in difference between flexural and tensile properties. Due to the various structures of the PCBs, the distances from the neutral plane of the composite are varied within the product and one property cannot represent warpage behavior of composites. To counter this, the composite was modelled as a tri-layer structure to represent heterogeneity along thickness direction. The effective modulus of each layer of tri-layer structure was calculated from accurately measured properties, and this modeling allowed us to predict the warpage behavior of the composite layers in various locations. From this study, we will provide direction to address the various structures in predicting the warpage of PCB and chip packages.
Advisors
Kim, Taek-Sooresearcher김택수researcher
Description
한국과학기술원 :기계공학과,
Publisher
한국과학기술원
Issue Date
2019
Identifier
325007
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 기계공학과, 2019.2,[iv, 30 p. :]

Keywords

chip package▼awarpage prediction▼aprinted circuit board▼afinite element analysis▼aFR4▼adigital image correlation method▼asimplified model▼a3-point bending test; 칩 패키지▼a휨 예측▼a인쇄 회로 기판▼a유한 요소 해석▼a유리 섬유 보강 폴리머▼a디지털 이미지 상관법▼a단순화 모델▼a3점 굽힘 시험

URI
http://hdl.handle.net/10203/265842
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=843013&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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