DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zhang, Shuye | ko |
dc.contributor.author | Qi, Xiaoquan | ko |
dc.contributor.author | Yang, Ming | ko |
dc.contributor.author | Cao, Yang | ko |
dc.contributor.author | Lin, Tiesong | ko |
dc.contributor.author | He, Peng | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2019-06-12T07:50:02Z | - |
dc.date.available | 2019-06-12T07:50:02Z | - |
dc.date.created | 2019-06-12 | - |
dc.date.issued | 2019-05 | - |
dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183 | - |
dc.identifier.issn | 0957-4522 | - |
dc.identifier.uri | http://hdl.handle.net/10203/262574 | - |
dc.description.abstract | Electrically conductive adhesives (ECAs) are mainly used in IC packaging, LED packaging and other electronic industry to replace the traditional soldering and lead-free solders, therefore, there is a constant need to improve the electrical conductive and mechanical property of ECAs. In this study, the electrical resistivity and shear strength of the modified nano-Ag coated Cu particles in ECA was investigated and compromised, in terms of filler contents, curing temperature and curing time. The conductive mechanism of the modified nano-Ag coated Cu particles in ECA was discussed as the filler content increased. Finally, the filler content was optimized by 23.5 vol% and 170 degrees C 100min curing condition was selected to obtain the compromised property (5.159x10(-6) cm 6.121MPa), which is better than the previous one (4.99x10(-6) cm, 4.406MPa) at 200 degrees C. The tested data, as well as the failure mode and fracture interfaces, were carried out in this study. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.title | A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives | - |
dc.type | Article | - |
dc.identifier.wosid | 000468437800011 | - |
dc.identifier.scopusid | 2-s2.0-85066020532 | - |
dc.type.rims | ART | - |
dc.citation.volume | 30 | - |
dc.citation.issue | 10 | - |
dc.citation.beginningpage | 9171 | - |
dc.citation.endingpage | 9183 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | - |
dc.identifier.doi | 10.1007/s10854-019-01246-8 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Zhang, Shuye | - |
dc.contributor.nonIdAuthor | Qi, Xiaoquan | - |
dc.contributor.nonIdAuthor | Yang, Ming | - |
dc.contributor.nonIdAuthor | Cao, Yang | - |
dc.contributor.nonIdAuthor | Lin, Tiesong | - |
dc.contributor.nonIdAuthor | He, Peng | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
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