Method for packaging flexible device using holding wafer, and flexible device manufactured by the same보유용 웨이퍼 및 이에 의해 제조된 플렉서블 기기를 이용하는 플렉서블 기기를 패키징하기 위한 방법
Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.