A tunneling field-effect transistor may be provided that includes: a substrate; a source which is formed on the substrate and into which p+ type impurity ion is injected; a drain which is formed on the substrate and into which n+ type impurity ion is injected; a plurality of vertically stacked nanowire channels which are formed on the substrate; a gate insulation layer which is formed on the plurality of nanowire channels; and a gate which is formed on the gate insulation layer. As a result, it is possible to generate a higher driving current without changing the length of the gate and the area of the channel (degree of integration).