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High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Young-Soo; Yoon, Chong K; Kim, Joungho, Electronic Components & Technology Conference, IEEEE, 2000-05-22 |
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls Ahn, Seungyoung; Ryu, Woonghwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woopoung; Paik, Kyung-Wook; et al, Electronics Manufacturing Technology Symposium, IEEE, 1999-10-18 |
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