Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls
- Publisher
- IEEE
- Issue Date
- 1999-10-18
- Language
- English
- Citation
Electronics Manufacturing Technology Symposium
- Appears in Collection
- GT-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.