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1
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

2
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seungyoung; Ryu, Woonghwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woopoung; Paik, Kyung-Wook; et al, Electronics Manufacturing Technology Symposium, IEEE, 1999-10-18

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