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Showing results 1 to 5 of 5

1
High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package

Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Young-Soo; Yoon, Chong K; Kim, Joungho, Electronic Components & Technology Conference, IEEEE, 2000-05-22

2
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

3
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seungyoung; Ryu, Woonghwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woopoung; Paik, Kyung-Wook; et al, Electronics Manufacturing Technology Symposium, IEEE, 1999-10-18

4
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

5
RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

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