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Showing results 1 to 4 of 4

1
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

2
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoung; Kwon, Woon-Seong; Paik, Kyung-Wook; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

3
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

4
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seungyoung; Ryu, Woonghwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woopoung; Paik, Kyung-Wook; et al, Electronics Manufacturing Technology Symposium, IEEE, 1999-10-18

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