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Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

Kim, Hyun Woong; Park, Gagyeong; Ryu, Seunghun; Kim, Jongwook; Lee, Jaehoon; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.141 - 146, IEEE, 2023-07-29

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