DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, JK | ko |
dc.contributor.author | Lee, Won-Jong | ko |
dc.date.accessioned | 2011-09-15 | - |
dc.date.available | 2011-09-15 | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-03 | - |
dc.identifier.citation | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.3A, pp.1408 - 1419 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10203/25187 | - |
dc.description.abstract | The dry etching mechanism of lead zirconate titanate (PZT) films was studied in high density CF4 and Cl-2/CF4 inductively coupled plasmas. The concentrations of atomic Cl and F as well as the flux and energy of bombarding ions were monitored as a function of etching parameters such as etching gas ratio, substrate bias voltage (V-s), induction coil power and process pressure. The compositions and chemical bonding states of etched PZT films were examined by X-ray photoelectron spectroscopy (XPS). The etching of PZT films in CF4-based plasma is chemically assisted sputter etching, and the dominant step of the overall etching process is either the formation or the removal of the etch by-products, depending on the etching conditions. The etching of PZT films in Cl-2/CF4 mixed plasma is mainly dominated by the formation of metal chlorides which depends on the concentration of the atomic Cl and the bombarding ion energy. The PZT film shows a maximum etch rate in 90%Cl-2/(Cl-2+CF4) plasma where the concentration of atomic Cl is maximum. The etch selectivity of PZT to Pt is less than 1.3 in CF4-based plasma, where as more than 2 in Cl-2/CF4 mixed plasma. The amount of sidewall residue is greatly reduced in Cl-2/CF4 mixed plasma compared with in CF4 plasma. A more vertical etch profile of PZT films can be obtained by lowering the process pressure and increasing the substrate bias voltage. | - |
dc.description.sponsorship | The Consortium of semiconductor advanced research(COSAR) as project No. 00-B6-00-09-00-01. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | INST PURE APPLIED PHYSICS | - |
dc.subject | THIN-FILM | - |
dc.subject | CAPACITORS | - |
dc.subject | MECHANISM | - |
dc.subject | DENSITY | - |
dc.subject | GASES | - |
dc.title | Dry etching characteristics of Pb(ZrTi)O-3 films in CF4 and Cl-2/CF4 inductively coupled plasmas | - |
dc.type | Article | - |
dc.identifier.wosid | 000170771500053 | - |
dc.identifier.scopusid | 2-s2.0-0035271146 | - |
dc.type.rims | ART | - |
dc.citation.volume | 40 | - |
dc.citation.issue | 3A | - |
dc.citation.beginningpage | 1408 | - |
dc.citation.endingpage | 1419 | - |
dc.citation.publicationname | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Won-Jong | - |
dc.contributor.nonIdAuthor | Jung, JK | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | PZT | - |
dc.subject.keywordAuthor | Pt | - |
dc.subject.keywordAuthor | etching | - |
dc.subject.keywordAuthor | ICP | - |
dc.subject.keywordAuthor | actinometry | - |
dc.subject.keywordAuthor | XPS | - |
dc.subject.keywordPlus | THIN-FILM | - |
dc.subject.keywordPlus | CAPACITORS | - |
dc.subject.keywordPlus | MECHANISM | - |
dc.subject.keywordPlus | DENSITY | - |
dc.subject.keywordPlus | GASES | - |
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