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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers

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김준모 / 이태익 / 조우성 / 조민수 / 김택수researcher
Publisher
대한용접·접합학회
Issue Date
2018-10-24
Language
English
Citation

MPC2018 Fall Conference

URI
http://hdl.handle.net/10203/248433
Appears in Collection
ME-Conference Papers(학술회의논문)
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