Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김준모 | ko |
| dc.contributor.author | 이태익 | ko |
| dc.contributor.author | 조우성 | ko |
| dc.contributor.author | 조민수 | ko |
| dc.contributor.author | 김택수 | ko |
| dc.date.accessioned | 2018-12-20T07:29:09Z | - |
| dc.date.available | 2018-12-20T07:29:09Z | - |
| dc.date.created | 2018-12-11 | - |
| dc.date.issued | 2018-10-24 | - |
| dc.identifier.citation | MPC2018 Fall Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/248433 | - |
| dc.language | English | - |
| dc.publisher | 대한용접·접합학회 | - |
| dc.title | Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | MPC2018 Fall Conference | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 코엑스, 서울 | - |
| dc.contributor.localauthor | 김택수 | - |
| dc.contributor.nonIdAuthor | 김준모 | - |
| dc.contributor.nonIdAuthor | 조민수 | - |
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