Bonding of silicon scanning mirror having vertical comb fingers

Abstract

A 1500 mum x 1200 mum silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. By flip chip bonding, the upper and lower structures having vertical comb fingers were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 degreesC for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner.