Adhesion and Mechanical Properties of Functional Thin Films for Flexible Electronics
- Publisher
- 한국마이크로전자패키징연구조합
- Issue Date
- 2017-04-06
- Language
- English
- Citation
한국마이크로전자패키징연구조합 2017년도 춘계 국제 심포지움
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.