Adhesion and Mechanical Properties of Functional Thin Films for Flexible Electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김택수 | ko |
| dc.date.accessioned | 2018-01-30T04:56:54Z | - |
| dc.date.available | 2018-01-30T04:56:54Z | - |
| dc.date.created | 2017-12-13 | - |
| dc.date.issued | 2017-04-06 | - |
| dc.identifier.citation | 한국마이크로전자패키징연구조합 2017년도 춘계 국제 심포지움 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/239356 | - |
| dc.language | English | - |
| dc.publisher | 한국마이크로전자패키징연구조합 | - |
| dc.title | Adhesion and Mechanical Properties of Functional Thin Films for Flexible Electronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 한국마이크로전자패키징연구조합 2017년도 춘계 국제 심포지움 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 코엑스 컨퍼런스룸 401호 | - |
| dc.contributor.localauthor | 김택수 | - |
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