High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same

Abstract

The method of the present invention comprises the steps of: providing an IC chip having I/O pads, each having a non-solder bump such as Au or Cu stud bump or Ni\Cu\Au bump formed thereon, and a substrate having metal electrodes formed thereon; applying a film-type non-conductive adhesive (NCA) to the chip or substrate, the adhesive including solid-phase bisphenol A type epoxy resin, liquid-phase bisphenol F type epoxy resin, solid-phase phenoxy resin, methylethylketone/toluene solvent, liquid-phase hardener, and non-conductive particles; and thermo-compressing the IC chip to the substrate so that the non-solder bump and the metal electrode can be mechanically and electrically connected. The NCA of the present invention has high reliability since it has lower thermal expansion coefficient and dielectric constant than conventional NCAs and has excellent mechanical and electrical characteristics. In addition, the NCA can be effectively selected at need and applied to diverse processes since it can be made to a form of paste rather than film. The method of the present invention is harmless to the environment since it does not employ conventional solder bumps using solder as a chief ingredient.