Browse "RIMS Collection" by Author Sundaram V.
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| Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission Kim W.; Madhavan R.; Mao J.; Choi J.; Choi S.; Ravi D.; Sundaram V.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1506 - 1512, 2004-06-01 |
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