Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 222
  • Download : 0
Issue Date
2004-06-01
Language
ENG
Citation

2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1506 - 1512

ISSN
0569-5503
URI
http://hdl.handle.net/10203/140987
Appears in Collection
RIMS Conference Papers
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0