유전체 도파관을 이용한 멀티채널 Chip-to-Chip 저전력 고속 유선 인터페이스Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide
- Assignee
- KAIST
- Country
- US (United States)
- Issue Date
- 2015-07-28
- Application Date
- 2013-12-11
- Application Number
- 14103005
- Registration Date
- 2015-07-28
- Registration Number
- 9093732
- Appears in Collection
- EE-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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