유전체 도파관을 이용한 멀티채널 Chip-to-Chip 저전력 고속 유선 인터페이스Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Bae, Hyeon-Min | ko |
| dc.contributor.author | Ha Il, Song | ko |
| dc.contributor.author | Jin, Huxian | ko |
| dc.date.accessioned | 2017-12-20T09:11:24Z | - |
| dc.date.available | 2017-12-20T09:11:24Z | - |
| dc.date.issued | 2015-07-28 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/232160 | - |
| dc.title | 유전체 도파관을 이용한 멀티채널 Chip-to-Chip 저전력 고속 유선 인터페이스 | - |
| dc.title.alternative | Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | Bae, Hyeon-Min | - |
| dc.contributor.assignee | KAIST | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 14103005 | - |
| dc.identifier.patentRegistrationNumber | 9093732 | - |
| dc.date.application | 2013-12-11 | - |
| dc.date.registration | 2015-07-28 | - |
| dc.publisher.country | US | - |
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